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US Patent 11056344 Layer forming method

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Patent abstract

There is provided a method of forming a layer, comprising depositing a seed layer on the substrate and depositing a bulk layer on the seed layer. Depositing the seed layer comprises supplying a first precursor comprising metal and halogen atoms to the substrate; and supplying a first reactant to the substrate. Depositing the bulk layer comprises supplying a second precursor comprising metal and halogen atoms to the seed layer and supplying a second reactant to the seed layer.

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Patent Inventor Names
Chiyu Zhu0
Kiran Shrestha0
Qi Xie0
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=110563440
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Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
110563440
Date of Patent
July 6, 2021
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Patent Application Number
156912410
Date Filed
August 30, 2017
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=110563440
Patent Citations
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Patent Primary Examiner
‌
Hsin-Yi Hsieh
0

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