Log in
Enquire now
‌

US Patent 7840305 Abrasive articles, CMP monitoring system and method

OverviewStructured DataIssuesContributors

Contents

Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
78403051
Patent Inventor Names
Brian D. Goers1
Gary M. Palmgren1
Vincent J. Laraia1
Andrew H. Behr1
Daniel B. Pendergrass, Jr.1
Date of Patent
November 23, 2010
1
Patent Application Number
114271541
Date Filed
June 28, 2006
1
Patent Citations Received
‌
US Patent 12023853 Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
2
‌
US Patent 11745302 Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
‌
US Patent 11772229 Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
‌
US Patent 11878389 Structures formed using an additive manufacturing process for regenerating surface texture in situ
3
‌
US Patent 11958162 CMP pad construction with composite material properties using additive manufacturing processes
4
‌
US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential
5
‌
US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods
6
‌
US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables
7
...
Patent Primary Examiner
‌
Sean P Shechtman
1
Patent abstract

The disclosure relates to abrasive articles useful in chemical-mechanical polishing (CMP), the articles including a substrate with opposite major surfaces, an abrasive material overlaying at least a portion of at least one of the major surfaces, and at least one of a radio frequency identification (RFID) tag, a RFID tag reader, or a sensor for providing CMP information to a transmitter positioned near the substrate, the transmitter positioned near the substrate and adapted to wirelessly receive CMP information and wirelessly transmit the CMP information to a remote receiver. The disclosure also relates to a CMP pad conditioner for wirelessly communicating CMP information to a remote receiver, a CMP process monitoring system for wirelessly communicating CMP information to a remote receiver, and a method for conditioning a CMP pad using a CMP process monitoring system for wireless communicating CMP information to a remote receiver.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 7840305 Abrasive articles, CMP monitoring system and method

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.