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US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential

Patent 11964359 was granted and assigned to Applied Materials on April, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
Applied Materials
Applied Materials
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Current Assignee
Applied Materials
Applied Materials
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119643590
Patent Inventor Names
Mahendra C. Orilall0
Mayu Yamamura0
Boyi Fu0
Rajeev Bajaj0
Daniel Redfield0
Ashwin Chockalingham0
Date of Patent
April 23, 2024
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Patent Application Number
166614000
Date Filed
October 23, 2019
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Patent Citations
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US Patent 6860793 Window portion with an adjusted rate of wear
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US Patent 6860802 Polishing pads for chemical mechanical planarization
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US Patent 6866807 High-precision modeling filament
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US Patent 6869350 Polishing pads and methods relating thereto
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US Patent 6875096 Chemical mechanical polishing pad having holes and or grooves
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US Patent 6875097 Fixed abrasive CMP pad with built-in additives
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US Patent 6896593 Microporous polishing pads
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US Patent 6913517 Microporous polishing pads
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...
Patent Primary Examiner
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Joel D Crandall
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CPC Code
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B24D 3/32
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B24D 3/30
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B24D 3/28
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B24D 3/26
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B24B 37/20
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B24B 37/22
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B24B 37/24
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B24B 37/245
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Patent abstract

Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

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