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US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods

Patent 11980992 was granted and assigned to Applied Materials on May, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
Applied Materials
Applied Materials
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Current Assignee
Applied Materials
Applied Materials
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119809920
Patent Inventor Names
Rajeev Bajaj0
Yan Zhao0
Ranga Rao Arnepalli0
Nag B. Patibandla0
Amritanshu Sinha0
Daniel Redfield0
Ashwin Chockalingam0
Mario Dagio Cornejo0
...
Date of Patent
May 14, 2024
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Patent Application Number
179465470
Date Filed
September 16, 2022
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Patent Citations
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US Patent 6860793 Window portion with an adjusted rate of wear
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US Patent 6860802 Polishing pads for chemical mechanical planarization
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US Patent 6866807 High-precision modeling filament
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US Patent 6869350 Polishing pads and methods relating thereto
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US Patent 6875096 Chemical mechanical polishing pad having holes and or grooves
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US Patent 6875097 Fixed abrasive CMP pad with built-in additives
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US Patent 6896593 Microporous polishing pads
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US Patent 6913517 Microporous polishing pads
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...
Patent Primary Examiner
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Pegah Parvini
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CPC Code
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B24B 37/20
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B24B 37/245
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B24B 37/26
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B33Y 80/00
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B29C 64/112
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Patent abstract

Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

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