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US Patent 6875097 Fixed abrasive CMP pad with built-in additives

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Is a
Patent
Patent
0

Patent attributes

Patent Applicant
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
68750970
Patent Inventor Names
John Grunwald0
Date of Patent
April 5, 2005
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Patent Application Number
106788780
Date Filed
October 3, 2003
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Patent Citations Received
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US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables
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US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods
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US Patent 12023853 Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
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US Patent 12011801 Printing a chemical mechanical polishing pad
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US Patent 11878389 Structures formed using an additive manufacturing process for regenerating surface texture in situ
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US Patent 11958162 CMP pad construction with composite material properties using additive manufacturing processes
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US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential
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Patent Primary Examiner
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David B. Thomas
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Patent abstract

This invention discloses fixed abrasive chemical mechanical polishing pads, wherein the pad itself comprises at least one material selected from the group consisting of oxidants, wetting agents and other additives normally delivered via a polishing slurry, which assist in the polishing effectiveness of the pad. The improved polishing pad provides both the benefit of a fixed abrasive and the benefits of slurry based polishing systems.

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