Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Abaneshwar Prasad0
Date of Patent
February 14, 2006
0Patent Application Number
104637300
Date Filed
June 17, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein about 10% or more of the elongated pores have an aspect ratio of about 3:1 or greater and are substantially oriented in a direction that is coplanar with the polishing surface. The invention further provides a method of polishing a substrate.
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