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US Patent 10322491 Printed chemical mechanical polishing pad

Patent 10322491 was granted and assigned to Applied Materials on June, 2019 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12023853 Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
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US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables
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US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods
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US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential
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US Patent 11951590 Polishing pads with interconnected pores
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Patent abstract

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

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Patent Inventor Names
Daniel Redfield0
Fred C. Redeker0
Gregory E. Menk0
Kasiraman Krishnan0
Mahendra Christopher Orilall0
Nag B. Patibandla0
Rajeev Bajaj0
Timothy Michaelson0
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Patent Citations Received
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US Patent 11685014 Formulations for advanced polishing pads
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=103224910
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Patent Citations Received
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US Patent 11524384 Abrasive delivery polishing pads and manufacturing methods thereof
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Patent Citations Received
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US Patent 11471999 Integrated abrasive polishing pads and manufacturing methods
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Infobox
Is a
Patent
Patent
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Patent Applicant
Applied Materials
Applied Materials
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Current Assignee
Applied Materials
Applied Materials
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
103224910
Date of Patent
June 18, 2019
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Patent Application Number
148859550
Date Filed
October 16, 2015
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=103224910
Patent Citations Received
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US Patent 11446788 Precursor formulations for polishing pads produced by an additive manufacturing process
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Patent Primary Examiner
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Eileen P. Morgan
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Edits on 21 Sep, 2022
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Patent Citations Received
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US Patent 11446788 Precursor formulations for polishing pads produced by an additive manufacturing process
0
Edits on 18 Jun, 2022
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edited on 18 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10322491

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