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US Patent 11524384 Abrasive delivery polishing pads and manufacturing methods thereof

Patent 11524384 was granted and assigned to Applied Materials on December, 2022 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
Applied Materials
Applied Materials
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Current Assignee
Applied Materials
Applied Materials
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
115243840
Patent Inventor Names
Ashavani Kumar0
Daniel Redfield0
Rajeev Bajaj0
Ashwin Chockalingam0
Date of Patent
December 13, 2022
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Patent Application Number
160485740
Date Filed
July 30, 2018
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Patent Citations
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US Patent 10086500 Method of manufacturing a UV curable CMP polishing pad
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US Patent 10005236 Cationic polymerizable compositions and methods of use thereof
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US Patent 10016877 Printed chemical mechanical polishing pad having abrasives therein and system for printing
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US Patent 10029405 Printing a chemical mechanical polishing pad
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US Patent 10537974 CMP pad construction with composite material properties using additive manufacturing processes
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US Patent 10593574 Techniques for combining CMP process tracking data with 3D printed CMP consumables
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US Patent 10618141 Apparatus for forming a polishing article that has a desired zeta potential
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US Patent 10675789 Polymer based molds and methods of manufacturing thereof
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...
Patent Primary Examiner
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Pegah Parvini
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CPC Code
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B24D 3/28
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B24D 3/346
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B24D 3/20
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B24B 37/245
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B24B 37/24
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Embodiments of the present disclosure provide for abrasive delivery (AD) polishing pads and manufacturing methods thereof. In one embodiment, a method of forming a polishing article includes forming a sub-polishing element from a first curable resin precursor composition and forming a plurality of polishing elements extending from the sub-polishing element. Forming the plurality of polishing elements includes forming a continuous polymer phase from a second curable resin precursor composition and forming a plurality of discontinuous abrasive delivery features disposed within the continuous polymer phase. The sub-polishing element is formed by dispensing a first plurality of droplets of the first curable resin precursor composition. The plurality polishing elements are formed by dispensing a second plurality of droplets of the second curable resin precursor composition. In some embodiments, the discontinuous abrasive delivery features comprise a water soluble material having abrasive particles interspersed therein.

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