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US Patent 7267610 CMP pad having unevenly spaced grooves

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
August 30, 2006
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Date of Patent
September 11, 2007
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Patent Application Number
11512994
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Patent Citations Received
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US Patent 12023853 Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
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US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential
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US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods
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US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables
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US Patent 11685014 Formulations for advanced polishing pads
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US Patent 11745302 Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
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US Patent 11772229 Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
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US Patent 11878389 Structures formed using an additive manufacturing process for regenerating surface texture in situ
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US Patent 11958162 CMP pad construction with composite material properties using additive manufacturing processes
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7267610
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Patent Primary Examiner
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Dung Van Nguyen
0

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