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US Patent 7186164 Processing pad assembly with zone control

Patent 7186164 was granted and assigned to Applied Materials on March, 2007 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Current Assignee
Applied Materials
Applied Materials
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7186164
Patent Inventor Names
Antoine P. Manens0
Date of Patent
March 6, 2007
Patent Application Number
10727774
Date Filed
December 3, 2003
Patent Citations Received
‌
US Patent 12023853 Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
0
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US Patent 11958162 CMP pad construction with composite material properties using additive manufacturing processes
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US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential
0
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US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods
0
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US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables
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US Patent 11685014 Formulations for advanced polishing pads
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US Patent 11745302 Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
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US Patent 11772229 Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
...
Patent Primary Examiner
‌
Eileen P. Morgan
Patent abstract

An electrochemical mechanical processing station having a zoned polishing pad assembly is provided. The zoned polishing pad assembly includes a conductive layer coupled to an upper layer having a non-conductive processing surface. At least two zones of different current permeability are defined across the processing surface of the upper layer. Each zone is defined by an attribute of the upper layer.

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