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US Patent 11887934 Package structure and fabrication methods

Patent 11887934 was granted and assigned to Applied Materials on January, 2024 by the United States Patent and Trademark Office.

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 US Patent 11887934 Package structure and fabrication methods

Article

Patent abstract

The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is structured by micro-blasting or laser ablation to form structures for formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor package with embedded dies therein.

Infobox
Is a
Patent
Patent
0
Patent Applicant
Applied Materials
Applied Materials
0
Current Assignee
Applied Materials
Applied Materials
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
118879340
Patent Inventor Names
Diego Tonini0
Giback Park0
Giorgio Cellere0
Han-Wen Chen0
Kyuil Cho0
Steven Verhaverbeke0
Vincent DiCaprio0
Date of Patent
January 30, 2024
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Patent Application Number
180751410
Date Filed
December 5, 2022
0
Patent Citations
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Patent Primary Examiner
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Nitin Parekh
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CPC Code
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H01L 23/5389
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H01L 23/5386
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H01L 23/5384
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H01L 23/49894
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H01L 23/49827
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H01L 23/147
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