Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hideaki Sakaguchi0
Masahiro Sunohara0
Mitsutoshi Higashi0
Kei Murayama0
Date of Patent
March 20, 2012
0Patent Application Number
124098730
Date Filed
March 24, 2009
0Patent Citations Received
0
...
Patent Primary Examiner
Patent abstract
A method includes the steps of providing a first tape base material on a single side of a stiffener substrate, forming, on the stiffener substrate, a cavity for accommodating a semiconductor chip therein, inserting the stiffener substrate in the cavity and providing the stiffener substrate on the first tape base material, sealing the semiconductor chip and the stiffener substrate with a sealing resin, and removing the first tape base material and forming a build-up layer on a tape removing surface.
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