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US Patent 8137497 Method of manufacturing wiring substrate

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 24, 2009
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Date of Patent
March 20, 2012
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Patent Application Number
12409873
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Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11837680 Substrate structuring methods
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US Patent 11862546 Package core assembly and fabrication methods
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US Patent 11881447 Package core assembly and fabrication methods
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US Patent 11887934 Package structure and fabrication methods
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US Patent 11927885 Fluoropolymer stamp fabrication method
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US Patent 11931855 Planarization methods for packaging substrates
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US Patent 11705365 Methods of micro-via formation for advanced packaging
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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
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Patent Inventor Names
Hideaki Sakaguchi
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Masahiro Sunohara
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Mitsutoshi Higashi
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Kei Murayama
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8137497
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Patent Primary Examiner
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Philip Tucker
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