Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 18, 2015
Patent Application Number
14579345
Date Filed
December 22, 2014
Patent Citations Received
0
...
Patent Primary Examiner
Patent abstract
A fan out package includes a molding compound, a conductive plug in the molding compound, a dielectric covering the molding compound and a portion of the conductive plug, and an interconnect disposed over the dielectric and contacted with the conductive plug, wherein a width of the interconnect contacting the conductive plug is substantially smaller than a width of the conductive plug in the molding compound, and a width of the interconnect disposed over the dielectric is substantially greater than the width of the conductive plug in the molding compound.
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