Golden has been acquired by ComplyAdvantage.Read about it here ⟶

‌

US Patent 8921995 Integrated circuit package including a three-dimensional fan-out/fan-in signal routing

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

89219950

Patent Inventor Names

Steven D. Cate0

Tarak A. Railkar0

Date of Patent

December 30, 2014

Patent Application Number

131836910

Date Filed

July 15, 2011

Patent Citations Received

‌

US Patent 12087679 Package core assembly and fabrication methods

‌

US Patent 11881447 Package core assembly and fabrication methods

‌

US Patent 11887934 Package structure and fabrication methods

‌

US Patent 11927885 Fluoropolymer stamp fabrication method

‌

US Patent 11931855 Planarization methods for packaging substrates

‌

US Patent 11676832 Laser ablation system for package fabrication

‌

US Patent 11705365 Methods of micro-via formation for advanced packaging

...

Patent Primary Examiner

‌

Chris Chu

No article content yet.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 8921995 Integrated circuit package including a three-dimensional fan-out/fan-in signal routing

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API