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US Patent 8890628 Ultra slim RF package for ultrabooks and smart phones

Patent 8890628 was granted and assigned to Intel on November, 2014 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

88906280

Patent Inventor Names

Carlton E. Hanna0

Dale A. Hackitt0

Vijay K. Nair0

Date of Patent

November 18, 2014

Patent Application Number

136009440

Date Filed

August 31, 2012

Patent Citations Received

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US Patent 12137516 Package with self shielding

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US Patent 11887934 Package structure and fabrication methods

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US Patent 11927885 Fluoropolymer stamp fabrication method

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US Patent 11931855 Planarization methods for packaging substrates

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US Patent 12087679 Package core assembly and fabrication methods

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US Patent 12125832 Semiconductor device and method of manufacturing a semiconductor device

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US Patent 11676832 Laser ablation system for package fabrication

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Patent Primary Examiner

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Joseph Chang

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