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US Patent 11705365 Methods of micro-via formation for advanced packaging

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 US Patent 11705365 Methods of micro-via formation for advanced packaging

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The present disclosure relates to micro-via structures for interconnects in advanced wafer level semiconductor packaging. The methods described herein enable the formation of high-quality, low-aspect-ratio micro-via structures with improved uniformity, thus facilitating thin and small-form-factor semiconductor devices having high I/O density with improved bandwidth and power.

Infobox
Is a
Patent
Patent
0
Patent Applicant
Applied Materials
Applied Materials
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Current Assignee
Applied Materials
Applied Materials
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
117053650
Date of Patent
July 18, 2023
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Patent Application Number
173233810
Date Filed
May 18, 2021
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Patent Citations
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Patent Primary Examiner
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Selim U Ahmed
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CPC Code
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H01L 21/475
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H01L 21/467
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H01L 21/32139
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H01L 21/32
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H01L 21/31144
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