List of Taiwan Semiconductor Manufacturing Company patents

Patents where

Current Assignee

Name

Taiwan Semiconductor Manufacturing Company

Name	Description	Patent Applicant	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 9000584 Packaged semiconductor device with a molding compound and a method of forming the same	Patent 9000584 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2015 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	9000584	April 7, 2015
‌ US Patent 9048233 Package systems having interposers	Patent 9048233 was granted and assigned to Taiwan Semiconductor Manufacturing Company on June, 2015 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	9048233	June 2, 2015
‌ US Patent 9472618 Nanowire field effect transistor device having a replacement gate	Patent 9472618 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2016 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	9472618	October 18, 2016
‌ US Patent 8816444 System and methods for converting planar design to FinFET design	Patent 8816444 was granted and assigned to Taiwan Semiconductor Manufacturing Company on August, 2014 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	8816444	August 26, 2014
‌ US Patent 9171929 Strained structure of semiconductor device and method of making the strained structure	Patent 9171929 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2015 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	9171929	October 27, 2015
‌ US Patent 10109721 Horizontal gate-all-around device having wrapped-around source and drain	Patent 10109721 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2018 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	10109721	October 23, 2018
‌ US Patent 11631658 Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device	Patent 11631658 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2023 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11631658	April 18, 2023
‌ US Patent 11495506 Semiconductor package with separate electric and thermal paths	Patent 11495506 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2022 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11495506	November 8, 2022
‌ US Patent 11322409 Multi-gate devices and method of fabricating the same			Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11322409	May 3, 2022
‌ US Patent 11776852 Method of manufacturing a semiconductor device and a semiconductor device	Patent 11776852 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2023 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11776852	October 3, 2023
‌ US Patent 9859254 Semiconductor structure and a manufacturing method thereof	Patent 9859254 was granted and assigned to Taiwan Semiconductor Manufacturing Company on January, 2018 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	9859254	January 2, 2018
‌ US Patent 11646346 Contact structure with air spacer for semiconductor device and method for forming the same	Patent 11646346 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2023 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11646346	May 9, 2023
‌ US Patent 11387191 Integrated circuit package and method	Patent 11387191 was granted and assigned to Taiwan Semiconductor Manufacturing Company on July, 2022 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11387191	July 12, 2022
‌ US Patent 11355468 Structure and method of forming a joint assembly	Patent 11355468 was granted and assigned to Taiwan Semiconductor Manufacturing Company on June, 2022 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11355468	June 7, 2022
‌ US Patent 11302804 Devices having a semiconductor material that is semimetal in bulk and methods of forming the same	Patent 11302804 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2022 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11302804	April 12, 2022
‌ US Patent 11581337 Three-dimensional memory device and manufacturing method thereof	Patent 11581337 was granted and assigned to Taiwan Semiconductor Manufacturing Company on February, 2023 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11581337	February 14, 2023
‌ US Patent 12062658 Method for forming an integrated circuit having transistor gates over an interconnection structure	Patent 12062658 was granted and assigned to Taiwan Semiconductor Manufacturing Company on August, 2024 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	12062658	August 13, 2024
‌ US Patent 11380655 Die stacks and methods forming same	Patent 11380655 was granted and assigned to Taiwan Semiconductor Manufacturing Company on July, 2022 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11380655	July 5, 2022
‌ US Patent 11626400 Semiconductor device structure incorporating air gap	Patent 11626400 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2023 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11626400	April 11, 2023
‌ US Patent 11424359 Semiconductor device structure with high voltage device	Patent 11424359 was granted and assigned to Taiwan Semiconductor Manufacturing Company on August, 2022 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11424359	August 23, 2022
‌ US Patent 11322450 Chip package and method of forming the same	Patent 11322450 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2022 by the United States Patent and Trademark Office.		Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11322450	May 3, 2022
‌ US Patent 11295979 Semiconductor package device with integrated antenna and manufacturing method thereof	Patent 11295979 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2022 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11295979	April 5, 2022
‌ US Patent 11476201 Package-on-package device	Patent 11476201 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2022 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11476201	October 18, 2022
‌ US Patent 11508671 Semiconductor package and manufacturing method thereof	Patent 11508671 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2022 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11508671	November 22, 2022
‌ US Patent 11621244 Integrated circuit package and method	Patent 11621244 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2023 by the United States Patent and Trademark Office.	Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company	United States Patent and Trademark Office	11621244	April 4, 2023

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