Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chen-Hua Yu0
Shang-Yun Hou0
Shin-Puu Jeng0
Wei-Cheng Wu0
Date of Patent
June 2, 2015
0Patent Application Number
127876610
Date Filed
May 26, 2010
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A package system includes an integrated circuit disposed over an interposer. The interposer includes a first interconnect structure. A first substrate is disposed over the first interconnect structure. The first substrate includes at least one first through silicon via (TSV) structure therein. A molding compound material is disposed over the first interconnect structure and around the first substrate. The integrated circuit is electrically coupled with the at least one first TSV structure.
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