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Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 16, 2016
Patent Application Number
14314327
Date Filed
June 25, 2014
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A chemical mechanical polishing pad is provided containing: a polyurethane polishing layer having a composition and a polishing surface; wherein the polyurethane polishing layer composition exhibits an acid number of ≧0.5 mg (KOH)/g; wherein the polishing surface is adapted for polishing a substrate; and, wherein the polishing surface exhibits a conditioning tolerance of ≧80%.
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