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US Patent 8801949 Method of forming open-network polishing pads

Overview Structured Data Issues Contributors Activity

Is a

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Michael D. Williams0

Ben W Schaefer0

Hamed Lakrout0

Date of Patent

August 12, 2014

Patent Application Number

13239951

Date Filed

September 22, 2011

Patent Citations Received

US Patent 12023853 Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

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US Patent 11878389 Structures formed using an additive manufacturing process for regenerating surface texture in situ

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US Patent 11958162 CMP pad construction with composite material properties using additive manufacturing processes

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US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential

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US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods

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US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables

0

US Patent 12006442 Additive manufacturing of polishing pads

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US Patent 11685014 Formulations for advanced polishing pads

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