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Roy Karl Potter

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Edits on 14 Dec, 2021
"Remove inverse infobox"
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Golden AI
edited on 14 Dec, 2021
Edits made to:
Infobox (-63 properties)
Infobox
Patent primary examiner of
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US Patent 7125810 Semiconductor device and method of manufacturing semiconductor device
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US Patent 7135756 Array of cells including a selection bipolar transistor and fabrication method thereof
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US Patent 7138717 HDP-based ILD capping layer
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US Patent 7141884 Module with a built-in semiconductor and method for producing the same
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US Patent 7154177 Semiconductor device with edge structure
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US Patent 7154182 Localized slots for stress relieve in copper
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US Patent 7161224 Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
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US Patent 7163873 Substrate for stressed systems and method of making same
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US Patent 7164207 Wiring structure for semiconductor device
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US Patent 7169640 Card manufacturing technique and resulting card
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US Patent 7169641 Semiconductor package with selective underfill and fabrication method therfor
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US Patent 7170170 Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
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US Patent 7173341 High performance thermally enhanced package and method of fabricating the same
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US Patent 7180146 Miniature magnetic field sensor
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US Patent 7180171 Single IC packaging solution for multi chip modules
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US Patent 7180177 Power supply component assembly on a printed circuit and method for obtaining same
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US Patent 7180183 Semiconductor device with reinforced under-support structure and method of fabricating the same
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US Patent 7180187 Interlayer connector for preventing delamination of semiconductor device
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US Patent 7183631 Package structure module of bump posited type lead frame
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US Patent 7183643 Stacked packages and systems incorporating the same
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US Patent 7187063 Manufacturing method for magnetic sensor and lead frame therefor
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US Patent 7187064 Electrical-interference-isolated transistor structure
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US Patent 7190057 Packaging component and semiconductor package
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US Patent 7196388 Microlens designs for CMOS image sensors
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US Patent 7196402 Interconnections
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US Patent 7198983 Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls
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US Patent 7199462 Substrate for producing semiconductor packages
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US Patent 7199464 Semiconductor device structures including protective layers formed from healable materials
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US Patent 7199472 Semiconductor device
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US Patent 7199476 Electronic device
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US Patent 7208785 Self-aligned Schottky-barrier clamped planar DMOS transistor structure and its manufacturing methods
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US Patent 7208819 Power module package having improved heat dissipating capability
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US Patent 7211893 Integrating chip scale packaging metallization into integrated circuit die structures
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US Patent 7215032 Triaxial through-chip connection
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US Patent 7218005 Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same
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US Patent 7221004 Semiconductor module
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US Patent 7221043 Integrated circuit carrier with recesses
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US Patent 7221046 System to control effective series resistance of power delivery circuit
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US Patent 7223695 Methods to deposit metal alloy barrier layers
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US Patent 7230322 Semiconductor device and method of manufacturing the same
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US Patent 7238602 Chip-size package structure and method of the same
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US Patent 7242090 Device package
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US Patent 7247887 Segmented channel MOS transistor
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US Patent 7247950 Semiconductor device and method of manufacturing the same
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US Patent 7250676 Multi-package module with heat spreader
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US Patent 7262492 Semiconducting device that includes wirebonds
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US Patent 7271432 Image-sensing apparatus
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US Patent 7279360 Semiconductor device and method of packaging the same
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US Patent 7282800 Semiconductor device and method of manufacturing the same
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US Patent 7282801 Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
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US Patent 7285849 Semiconductor die package using leadframe and clip and method of manufacturing
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US Patent 7291925 Stack package using anisotropic conductive film (ACF) and method of making same
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US Patent 7294913 Cathodic lead insulator
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US Patent 7298051 Semiconductor element and manufacturing method thereof
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US Patent 7300849 Bandgap engineered mono-crystalline silicon cap layers for SiGe HBT performance enhancement
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US Patent 7301234 Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same
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US Patent 7309909 Leadframes for improved moisture reliability of semiconductor devices
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US Patent 7323728 Semiconductor device
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US Patent 7344918 Electronic assembly with integrated IO and power contacts
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US Patent 7348682 Method and structures for indexing dice
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US Patent 7355209 Light emitting diode and method making the same
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US Patent 7374968 Method of utilizing a contact printing stamp
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US Patent 7375427 Semiconductor device, circuit board, electro-optic device, electronic device
Edits on 29 Nov, 2021
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Golden AI
edited on 29 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
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US Patent 7375427 Semiconductor device, circuit board, electro-optic device, electronic device
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Golden AI
edited on 29 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
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US Patent 7374968 Method of utilizing a contact printing stamp
Edits on 25 Nov, 2021
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Golden AI
edited on 25 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
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US Patent 7355209 Light emitting diode and method making the same
Edits on 24 Nov, 2021
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Golden AI
edited on 24 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7348682 Method and structures for indexing dice
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Golden AI
edited on 24 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7344918 Electronic assembly with integrated IO and power contacts
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Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7323728 Semiconductor device
Edits on 23 Nov, 2021
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Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7309909 Leadframes for improved moisture reliability of semiconductor devices
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Golden AI
edited on 23 Nov, 2021
Golden AI profile picture
Golden AI
edited on 23 Nov, 2021
Golden AI profile picture
Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7298051 Semiconductor element and manufacturing method thereof
Golden AI profile picture
Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7294913 Cathodic lead insulator
Golden AI profile picture
Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7291925 Stack package using anisotropic conductive film (ACF) and method of making same
Golden AI profile picture
Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7285849 Semiconductor die package using leadframe and clip and method of manufacturing
Golden AI profile picture
Golden AI
edited on 23 Nov, 2021
Golden AI profile picture
Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7282800 Semiconductor device and method of manufacturing the same
Golden AI profile picture
Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7279360 Semiconductor device and method of packaging the same
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7271432 Image-sensing apparatus
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7262492 Semiconducting device that includes wirebonds
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7250676 Multi-package module with heat spreader

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