Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tadayoshi Muta0
Manabu Takayama0
Riichi Saito0
Tadanori Suto0
Hiroyuki Morimoto0
Jin Tachikawa0
Date of Patent
October 24, 2006
0Patent Application Number
109647140
Date Filed
October 15, 2004
0Patent Primary Examiner
Patent abstract
The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
