Patent attributes
An electronic device has at least one semiconductor chip, which has mutually opposing contact sides, of which one first contact side is electroconductively surface-bonded via a first, solid soldering-agent layer to at least one first metallic conductor part. The semiconductor chip is electroconductively surface-bonded on its second contact side facing opposite the first contact side via a second soldering-agent layer to at least one second metallic conductor part. The softening temperature of the second soldering-agent layer is adapted to an operating temperature that occurs in this soldering-agent layer during operation of the device in such a way that the second soldering-agent layer is doughy or liquid at the operating temperature. The second soldering-agent layer is laterally bounded by a flow-off protection device.
