Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
May 22, 2007
Patent Application Number
10970237
Date Filed
October 21, 2004
Patent Primary Examiner
Patent abstract
According to some embodiments, a system includes an integrated circuit package to support an integrated circuit die. The integrated circuit package may include a plurality of conductive contacts, and an element having a plurality of resistive portions, each of the plurality of resistive portions being coupled to a respective one of the plurality of conductive contacts. The integrated circuit package may further include a decoupling capacitor having a plurality of capacitor pads, each of the plurality of capacitor pads being coupled to a respective one of the plurality of resistive portions.
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