Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 27, 2007
Patent Application Number
10937647
Date Filed
September 8, 2004
Patent Primary Examiner
Patent abstract
The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices.
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