US Patent 7699684 CMP porous pad with component-filled pores

Is a

Patent

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Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7699684

Date of Patent

April 20, 2010

Patent Application Number

11690944

Date Filed

March 26, 2007

Patent Citations Received

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US Patent 12023853 Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

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US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential

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US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods

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US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables

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US Patent 11685014 Formulations for advanced polishing pads

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US Patent 11691241 Abrasive lapping head with floating and rigid workpiece carrier

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US Patent 11745302 Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process

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US Patent 11772229 Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

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Patent Primary Examiner

‌

Lee D. Wilson

Patent abstract

This invention provides a method for polishing pad comprising a polymeric material having pores and a component that is disposed within the pores.

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US Patent 7699684 CMP porous pad with component-filled pores

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