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Junghwa M. Im

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Edits on 15 Dec, 2021
"Remove inverse infobox"
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Golden AI
edited on 15 Dec, 2021
Edits made to:
Infobox (-18 properties)
Infobox
Patent primary examiner of
‌
US Patent 7358616 Semiconductor stacked die/wafer configuration and packaging and method thereof
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US Patent 7358618 Semiconductor device and manufacturing method thereof
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US Patent 7361992 Semiconductor device including interconnects formed by damascene process and manufacturing method thereof
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US Patent 7361993 Terminal pad structures and methods of fabricating same
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US Patent 7372142 Vertical conduction power electronic device package and corresponding assembling method
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US Patent 7374174 Small electrode for resistance variable devices
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US Patent 7928462 Light emitting device having vertical structure, package thereof and method for manufacturing the same
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US Patent 7939383 Method for fabricating semiconductor package free of substrate
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US Patent 7956451 Packages for encapsulated semiconductor devices and method of making same
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US Patent 7968371 Semiconductor package system with cavity substrate
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US Patent 7968377 Integrated circuit protruding pad package system
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US Patent 7968998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
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US Patent 7985627 Thermal intermediate apparatus, systems, and methods
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US Patent 7989940 System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures
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US Patent 7994590 High dielectric constant insulators and associated fabrication methods
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US Patent 7999369 Power electronic package having two substrates with multiple semiconductor chips and electronic components
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US Patent 8003513 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
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US Patent 8004061 Conductive trace with reduced RF impedance resulting from the skin effect
Edits on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8004061 Conductive trace with reduced RF impedance resulting from the skin effect
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Golden AI
edited on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7994590 High dielectric constant insulators and associated fabrication methods
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Golden AI
edited on 8 Dec, 2021
Edits on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7985627 Thermal intermediate apparatus, systems, and methods
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Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7968377 Integrated circuit protruding pad package system
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7968371 Semiconductor package system with cavity substrate
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Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7956451 Packages for encapsulated semiconductor devices and method of making same
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7939383 Method for fabricating semiconductor package free of substrate
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Golden AI
edited on 7 Dec, 2021
Edits on 29 Nov, 2021
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Golden AI
edited on 29 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7374174 Small electrode for resistance variable devices
Edits on 26 Nov, 2021
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Golden AI
edited on 26 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7372142 Vertical conduction power electronic device package and corresponding assembling method
Edits on 25 Nov, 2021
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Golden AI
edited on 25 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7361993 Terminal pad structures and methods of fabricating same
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Golden AI
edited on 25 Nov, 2021
Golden AI profile picture
Golden AI
edited on 25 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7358618 Semiconductor device and manufacturing method thereof
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Golden AI
edited on 25 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7358616 Semiconductor stacked die/wafer configuration and packaging and method thereof
"Created via: Entity Importer"
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Golden AI
created this topic on 25 Nov, 2021
Edits made to:
Infobox (+2 properties)
‌

 Junghwa M. Im

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Is a
Person
Person
Current Employer
United States Patent and Trademark Office
United States Patent and Trademark Office

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