Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kazutaka Shibata0
Date of Patent
April 15, 2008
0Patent Application Number
106080160
Date Filed
June 30, 2003
0Patent Primary Examiner
Patent abstract
A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on this surface. The first resin film has elasticity low enough to reduce stress induced by a difference in thermal expansion coefficient between the semiconductor substrate and the first resin film. A second resin film, having higher elasticity or higher strength than the first resin film, may be formed on the other surface of the semiconductor substrate.
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