Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 28, 2011
Patent Application Number
11164336
Date Filed
November 18, 2005
Patent Primary Examiner
Patent abstract
A semiconductor package system is provided including providing a cavity substrate having a cavity provided therein, attaching a metal die pad to the cavity substrate, attaching a semiconductor die in the cavity to the metal die pad, and attaching solder connectors to the cavity substrate for connection on the system board with the metal die pad on the system board.
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