US Patent 7985627 Thermal intermediate apparatus, systems, and methods

Patent 7985627 was granted and assigned to Intel on July, 2011 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7985627

Date of Patent

July 26, 2011

Patent Application Number

12277075

Date Filed

November 24, 2008

Patent Primary Examiner

‌

Junghwa M. Im

Patent abstract

Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.