US Patent 8841765 Multi-chip module with stacked face-down connected dies

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Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

88417650

Patent Inventor Names

Ilyas Mohammed0

Piyush Savalia0

Belgacem Haba0

Date of Patent

September 23, 2014

Patent Application Number

130923760

Date Filed

April 22, 2011

Patent Citations Received

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US Patent RE49987 Multiple plated via arrays of different wire heights on a same substrate

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US Patent 11854785 Package structure for heat dissipation

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US Patent 11929337 3D-interconnect

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US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing

Patent Primary Examiner

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S. V. Clark

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