Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming-Fa Chen0
Chen-Hua Yu0
Sung-Feng Yeh0
Date of Patent
December 26, 2023
0Patent Application Number
178386480
Date Filed
June 13, 2022
0Patent Citations
...
Patent Primary Examiner
Patent abstract
A package structure and method of manufacturing is provided, whereby heat dissipating features are provided for heat dissipation. Heat dissipating features include conductive vias formed in a die stack, thermal chips, and thermal metal bulk, which can be bonded to a wafer level device. Hybrid bonding including chip to chip, chip to wafer, and wafer to wafer provides thermal conductivity without having to traverse a bonding material, such as a eutectic material. Plasma dicing the package structure can provide a smooth sidewall profile for interfacing with a thermal interface material.
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