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US Patent 8184463 Semiconductor apparatus

Patent 8184463 was granted and assigned to Hitachi on May, 2012 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
Hitachi
Hitachi
Date Filed
December 13, 2009
Date of Patent
May 22, 2012
Patent Application Number
12636758
Patent Citations Received
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US Patent 12136562 3D semiconductor device and structure with single-crystal layers
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US Patent 12094965 3D semiconductor device and structure with metal layers and memory cells
0
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US Patent 12120880 3D semiconductor device and structure with logic and memory
0
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US Patent 12125737 3D semiconductor device and structure with metal layers and memory cells
0
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US Patent 11694922 Multilevel semiconductor device and structure with oxide bonding
0
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US Patent 11694944 3D semiconductor device and structure with metal layers and a connective path
0
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US Patent 11711928 3D memory devices and structures with control circuits
0
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US Patent 11763864 3D memory semiconductor devices and structures with bit-line pillars
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US Patent 11784082 3D semiconductor device and structure with bonding
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US Patent 11784169 3D semiconductor device and structure with metal layers
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8184463
Patent Primary Examiner
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Ly D Pham

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