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US Patent 11711928 3D memory devices and structures with control circuits

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Is a
Patent
Patent
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Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
117119280
Date of Patent
July 25, 2023
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Patent Application Number
181058560
Date Filed
February 5, 2023
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Patent Citations
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US Patent 8343851 Wafer temporary bonding method using silicon direct bonding
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US Patent 9589982 Structure and method of operation for improved gate capacity for 3D NOR flash memory
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US Patent 9595530 Methods and apparatus for vertical bit line structures in three-dimensional nonvolatile memory
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US Patent 9627287 Thinning in package using separation structure as stop
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US Patent 9673257 Vertical thin film transistors with surround gates
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US Patent 9786677 Memory device having memory cells connected in parallel to common source and drain and method of fabrication
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US Patent 9842651 Three-dimensional vertical NOR flash thin film transistor strings
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US Patent 9997530 Three-dimensional semiconductor memory device and method of fabricating the same
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...
Patent Primary Examiner
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David A Zarneke
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CPC Code
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H01L 2224/08145
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H01L 25/18
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H01L 25/0657
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H01L 25/50
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H01L 23/544
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H01L 24/80
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H01L 24/08
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A semiconductor device, the device including: a first level including control circuits, where the control circuits include a plurality of first transistors and a plurality of metal layers; and a memory level disposed on top of the first level, where the memory level includes an array of memory cells, where each of the memory cells includes at least one second transistor, where the control circuits control access to the array of memory cells, where the first level is bonded to the memory level, where the bonded includes oxide to oxide bonding regions and a plurality of metal to metal bonding regions, and where at least a portion of the array of memory cells is disposed directly above at least one of the plurality of metal to metal bonding regions.

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