Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 13, 2012
Patent Application Number
12283443
Date Filed
September 12, 2008
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
The invention relates to multi-planar logic components in a three-dimensional (3D) integrated circuit (IC) apparatus configuration. A multi-planar integrated circuit connected by through silicon vias is configured to connect microprocessor, FPGA and memory components. The integrated circuit components may be on tiles of layers of the 3D IC.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.