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US Patent 7864568 Semiconductor storage device

Patent 7864568 was granted and assigned to Renesas Electronics on January, 2011 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
Renesas Electronics
Renesas Electronics
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7864568
Date of Patent
January 4, 2011
Patent Application Number
12516690
Date Filed
December 7, 2006
Patent Citations Received
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US Patent 12136562 3D semiconductor device and structure with single-crystal layers
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US Patent 12094965 3D semiconductor device and structure with metal layers and memory cells
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US Patent 12120880 3D semiconductor device and structure with logic and memory
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US Patent 12125737 3D semiconductor device and structure with metal layers and memory cells
0
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US Patent 11694922 Multilevel semiconductor device and structure with oxide bonding
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US Patent 11694944 3D semiconductor device and structure with metal layers and a connective path
0
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US Patent 11711928 3D memory devices and structures with control circuits
0
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US Patent 11763864 3D memory semiconductor devices and structures with bit-line pillars
...
Patent Primary Examiner
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Huan Hoang
Patent abstract

In a semiconductor storage device such as a phase change memory, a technique which can realize high integration is provided. The semiconductor storage device includes a phase change thin film 101 having two stable phases of a crystal state with low electric resistance and an amorphous state with high electric resistance, upper plug electrodes 102 and 103 provided on one side of the phase change thin film 101, a lower electrode 104 provided on the other side of the phase change thin film 101, a selecting transistor 114 whose drain/source terminals are connected to the upper plug electrode 102 and the lower electrode 104, and a selecting transistor 115 whose drain/source terminals are connected to the upper plug electrode 103 and the lower electrode 104, and a first memory cell is configured with the selecting transistor 114 and a phase change region 111 in the phase change thin film 101 sandwiched between the upper plug electrode 102 and the lower electrode 104, and a second memory cell is configured with the selecting transistor 115 and a phase change region 112 in the phase change thin film 101 sandwiched between the upper plug electrode 103 and the lower electrode 104.

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