Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 25, 2010
Patent Application Number
11737598
Date Filed
April 19, 2007
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.
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