Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 30, 2008
Patent Application Number
11092498
Date Filed
March 29, 2005
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A method of coupling substrates together includes steps of providing first and second substrates. The second substrate includes a conductive bonding region positioned on its surface. Heat is provided to the conductive bonding region to reduce its number of defects. The surface of the conductive bonding region is bonded to the first substrate so that the conductive bonding region and the first substrate are coupled together.
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