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US Patent 7198980 Methods for assembling multiple semiconductor devices

Patent 7198980 was granted and assigned to Micron Technology on April, 2007 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
Micron Technology
Micron Technology
Date Filed
November 12, 2003
Date of Patent
April 3, 2007
Patent Application Number
10706576
Patent Citations Received
‌
US Patent 12113026 Multi-chip package and method of providing die-to-die interconnects in same
0
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US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing
0
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US Patent RE49987 Multiple plated via arrays of different wire heights on a same substrate
0
‌
US Patent 12009343 Stackable package and method
0
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US Patent 11715691 Integrated circuit package with integrated voltage regulator
0
‌
US Patent 11855023 Wafer level fan out semiconductor device and manufacturing method thereof
0
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US Patent 11876053 Multi-chip package and method of providing die-to-die interconnects in same
0
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US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7198980
Patent Primary Examiner
‌
Carl Whitehead, Jr.

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