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US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof

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Contents

Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
119425811
Patent Inventor Names
Curtis Zwenger1
David Clark1
Date of Patent
March 26, 2024
1
Patent Application Number
179020351
Date Filed
September 2, 2022
1
Patent Citations
‌
US Patent 8618648 Methods for flip chip stacking
1
‌
US Patent 9048125 Semiconductor device and manufacturing method thereof
1
‌
US Patent 9064718 Pre-formed via array for integrated circuit package
1
‌
US Patent RE45642 Polarizing element and liquid crystal projector
1
‌
US Patent 9543242 Semiconductor package and fabricating method thereof
1
‌
US Patent 9754982 Packaging module and substrate structure thereof
1
‌
US Patent 9960328 Semiconductor device and manufacturing method thereof
1
‌
US Patent 10490716 Semiconductor device with optically-transmissive layer and manufacturing method thereof
1
...
Patent Primary Examiner
‌
Quoc D Hoang
1
CPC Code
‌
H01L 33/58
1
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H01L 21/6835
1
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H01L 24/32
1
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H01L 24/16
1
Patent abstract

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that that comprises a transparent, translucent, non-opaque, or otherwise optically-transmissive, external surface.

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