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US Patent 12094694 Substrate processing apparatus and substrate processing method

Patent 12094694 was granted and assigned to Tokyo Electron on September, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
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Current Assignee
Tokyo Electron
Tokyo Electron
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Date Filed
January 14, 2021
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Date of Patent
September 17, 2024
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Patent Applicant
Tokyo Electron
Tokyo Electron
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Patent Application Number
17149246
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Patent Citations
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US Patent 10347547 Suppressing interfacial reactions by varying the wafer temperature throughout deposition
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US Patent 11868056 Substrate processing apparatus
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US Patent 10358715 Integrated cluster tool for selective area deposition
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US Patent 7824934 Substrate processing apparatus, parameter management system for substrate processing apparatus, parameter management method for substrate processing apparatus, program, and storage medium
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US Patent 7915179 Insulating film forming method and substrate processing method
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US Patent 8813678 Substrate processing apparatus
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US Patent 10069443 Dechuck control method and plasma processing apparatus
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US Patent 10274827 Substrate treating apparatus and substrate treating method
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Patent Inventor Names
Tamihiro Kobayashi
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Sumi Tanaka
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12094694
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Patent Primary Examiner
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Jethro M. Pence
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