Log in
Enquire now
‌

US Patent 12094694 Substrate processing apparatus and substrate processing method

Patent 12094694 was granted and assigned to Tokyo Electron on September, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Applicant
Tokyo Electron
Tokyo Electron
1
Current Assignee
Tokyo Electron
Tokyo Electron
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
120946941
Patent Inventor Names
Tamihiro Kobayashi1
Sumi Tanaka1
Date of Patent
September 17, 2024
1
Patent Application Number
171492461
Date Filed
January 14, 2021
1
Patent Citations
‌
US Patent 10347547 Suppressing interfacial reactions by varying the wafer temperature throughout deposition
1
‌
US Patent 11868056 Substrate processing apparatus
1
‌
US Patent 10358715 Integrated cluster tool for selective area deposition
1
‌
US Patent 7824934 Substrate processing apparatus, parameter management system for substrate processing apparatus, parameter management method for substrate processing apparatus, program, and storage medium
1
‌
US Patent 7915179 Insulating film forming method and substrate processing method
1
‌
US Patent 8813678 Substrate processing apparatus
1
‌
US Patent 10069443 Dechuck control method and plasma processing apparatus
1
‌
US Patent 10274827 Substrate treating apparatus and substrate treating method
1
Patent Primary Examiner
‌
Jethro M. Pence
1
Patent abstract

A substrate processing apparatus includes: a processing chamber including a processing room; a heating unit that heats the processing chamber; a support including a base thermally isolated from the processing chamber and fixed to the processing chamber, and a stage inserted into an opening provided toward the processing room while being supported by the base at a position distant from a reference position in a horizontal direction, and holds the substrate in the processing room; a stage peripheral member provided in the processing chamber along a periphery of the stage in a state of being inserted into the opening; and a first positioning pin fixed to the processing chamber to position the stage peripheral member, and a second positioning pin fixed to a position farther than the first positioning pin.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 12094694 Substrate processing apparatus and substrate processing method

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.