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US Patent 11525967 Photonics integrated circuit architecture

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
Apple (company)
Apple (company)
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
115259670
Patent Inventor Names
Jason Pelc0
Mark Arbore0
Alfredo Bismuto0
Andrea Trita0
Hooman Abediasl0
Date of Patent
December 13, 2022
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Patent Application Number
165828380
Date Filed
September 25, 2019
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Patent Citations
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US Patent 10285898 Responsive whole patient care compression therapy and treatment system
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US Patent 10295740 Integrating silicon photonics and laser dies using flip-chip technology
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US Patent 10429582 Waveguide-to-waveguide couplers with multiple tapers
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US Patent 10429597 Interposer assemblies and arrangements for coupling at least one optical fiber to at least one optoelectronic device
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US Patent 10634843 Photonic integrated circuit with laser and isolator
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US Patent 10687718 Systems and methods for non-pulsatile blood volume measurements
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US Patent 10823912 Silicon photonics using off-cut wafer having top-side vertical outcoupler from etched cavity
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US Patent 10852492 Techniques to combine two integrated photonic substrates
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Patent Citations Received
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US Patent 12111207 Despeckling in optical measurement systems
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US Patent 11881678 Photonics assembly with a photonics die stack
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US Patent 11914201 Mechanisms that transfer light between layers of multi-chip photonic assemblies
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US Patent 11997819 Data processing systems including optical communication modules
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US Patent 12004318 Data processing systems including optical communication modules
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US Patent 12019289 Communication systems having pluggable modules
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US Patent 12029004 Data processing systems including optical communication modules
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0
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Patent Primary Examiner
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Kaveh C Kianni
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CPC Code
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G02B 6/2938
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G02B 6/00
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G02B 6/4215
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G02B 6/29301
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This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

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