‌

US Patent 10852492 Techniques to combine two integrated photonic substrates

Patent 10852492 was granted and assigned to Acacia Communications on December, 2020 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors

Is a

Patent

Patent attributes

Patent Applicant

Acacia Communications

Current Assignee

Acacia Communications

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

108524920

Date of Patent

December 1, 2020

Patent Application Number

149268680

Date Filed

October 29, 2015

Patent Citations Received

‌

US Patent 11561346 Tunable echelle grating

‌

US Patent 12089931 Optical sensor for skin-contact detection and physiological parameter measurement at wearable electronic device

‌

US Patent 11500154 Asymmetric optical power splitting system and method

‌

US Patent 11506535 Diffraction grating design

‌

US Patent 11525967 Photonics integrated circuit architecture

‌

US Patent 11525958 Off-cut wafer with a supported outcoupler

‌

US Patent 11552454 Integrated laser source

...

Patent Primary Examiner

‌

Peter Radkowski

No article content yet.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 10852492 Techniques to combine two integrated photonic substrates

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API