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US Patent 11501966 Selective layer formation using deposition and removing

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Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11501966
Date of Patent
November 15, 2022
Patent Application Number
17113383
Date Filed
December 7, 2020
Patent Citations
‌
US Patent 10047435 Dual selective deposition
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US Patent 10049924 Selective formation of metallic films on metallic surfaces
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US Patent 10115603 Removal of surface passivation
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US Patent 10157786 Selective formation of metallic films on metallic surfaces
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US Patent 10186420 Formation of silicon-containing thin films
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US Patent 10204782 Combined anneal and selective deposition process
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US Patent 10343186 Vapor phase deposition of organic films
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US Patent 10373820 Deposition of organic films
...
Patent Citations Received
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US Patent 11804373 Selective layer formation using deposition and removing
Patent Primary Examiner
‌
Ratisha Mehta

Methods and systems for selectively depositing dielectric films on a first surface of a substrate relative to a passivation layer previously deposited on a second surface are provided. The methods can include at least one cyclical deposition process used to deposit material on the first surface while the passivation layer is removed, thereby preventing deposition over the passivation layer.

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