US Patent 9978656 Mechanisms for forming fine-pitch copper bump structures
Patent 9978656 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2018 by the United States Patent and Trademark Office.
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Patent abstract
The mechanisms of forming a copper post structures described enable formation of copper post structures on a flat conductive surface. In addition, the copper post structures are supported by a molding layer with a Young's modulus (or a harder material) higher than polyimide. The copper post structures formed greatly reduce the risk of cracking of passivation layer and delamination of at the dielectric interface surrounding the copper post structures.
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US Patent 09978656 Mechanisms for forming fine-pitch copper bump structures US Patent 9978656 Mechanisms for forming fine-pitch copper bump structures
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Patent Number
0997865600
Patent Number
997865600
Edits on 29 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
099786560
Date of Patent
May 22, 2018
0Patent Application Number
134062700
Date Filed
February 27, 2012
0Patent Primary Examiner
Edits on 27 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
099786560
Date of Patent
May 22, 2018
0Patent Application Number
134062700
Date Filed
February 27, 2012
0Patent Primary Examiner
Edits on 20 Jan, 2022
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 09978656 Mechanisms for forming fine-pitch copper bump structures
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
09978656
Date of patent
May 22, 2018
Patent application number
13406270
Date Filed
February 27, 2012
Patent primary examiner
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