Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wen-Hsiung Lu0
Chen-En Yen0
Kai-Jun Zhan0
Ming-Da Cheng0
Chin-Wei Kang0
Cheng-Jen Lin0
Mirng-Ji Lii0
Date of Patent
March 26, 2024
0Patent Application Number
174091380
Date Filed
August 23, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
Patent abstract
A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.
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