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US Patent 9000600 Reduced stress TSV and interposer structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 11, 2014
Date of Patent
April 7, 2015
Patent Application Number
14204860
Patent Citations Received
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US Patent 12132020 Low temperature bonded structures
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US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
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US Patent 11778852 Display device and method of manufacturing the same
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US Patent 11894326 Multi-metal contact structure
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US Patent 11908739 Flat metal features for microelectronics applications
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US Patent 11972973 Semiconductor structure and method of manufacturing a semiconductor structure
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US Patent 11973056 Methods for low temperature bonding using nanoparticles
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US Patent 12027487 Structures for low temperature bonding using nanoparticles
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Patent Inventor Names
Huailiang Wei
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Terrence Caskey
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Craig Mitchell
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Cyprian Emeka Uzoh
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Kishor V. Desai
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Belgacem Haba
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Charles G. Woychik
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9000600
Patent Primary Examiner
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Karen Kusumakar

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