Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ding-Ming Kwai0
Yung-Fa Chou0
Date of Patent
April 29, 2014
0Patent Application Number
129861840
Date Filed
January 7, 2011
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A stacked structure and a stacked method for a three-dimensional integrated circuit are provided. The provided stacked method includes separating a logic chip into a function chip and an I/O chip; stacking the function chip above the I/O chip; and stacking at least one memory chip between the function chip and the I/O chip.
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